Publications

Graduate Theses

2001  Mark Kiehlbauch — Innovative Techniques in Plasma Modeling
1991  Maheswaran Surendra — Numerical Simulations of Glow Discharges

2017

  1. "Effective dose delivery in atmospheric pressure plasma jets for plasma medicine: a model predictive control approach," D. Gidon, D.B. Graves and A. Mesbah, Plasma Sources Science and Technology, Accepted June 2017.https://doi.org/10.1088/1361-6595/aa7c5d.                                                                                                                                                                            
  2.  "Mechanisms of Plasma Medicine: Coupling Plasma Physics, Biochemistry and Biology,"  IEEE Transactions on Radiation and Plasma Medical Sciences, 1(4):281-292, 2017. https://doi.org/10.1109/TRPMS.2017.2710880.                                                                               
  3.  "A Novel cupping-assisted plasma treatment for skin disinfection," Z. Xiong and D.B. Graves. Journal of Physics D: Applied Physics, 50(5), 2017. http://dx.doi.org/10.1088/1361-6463/50/5/05LT01.      

2016

  1. "The Role of Interfacial Reactions in Determining Plasma-Liquid Chemistry," C.E. Anderson, N.R. Cha, A.D. Lindsay, D.S. Clark, and D.B. Graves, Plasma Chemistry and Plasma Processing, Accepted August 2016. http://doi.org/10.1007/s1109001697421.

  2. "Etching mechanisms of graphene nanoribbons in downstream H 2 plasmas: insights from molecular dynamics simulations," A. Davydova, Despiau-Pujo, E., Cunge, G., & Graves, D. B. (2015). Journal of Physics D: Applied Physics, 48(19), 195202. http://doi.org/10.1088/0022-3727/48/19/195202                                                             
  3. "Mechanisms of Selective Antitumor Action of Cold Atmospheric Plasma-Derived Reactive Oxygen and Nitrogen Species," Plasma Processes and Polymers, 13:1157-1178, 2016. http://doi.org/10.1002/ppap.201600089.                                                                            
  4. "Model predictive control of thermal effects of atmospheric pressure plasma jet for biomedical applications," D. Gidon, D.B. Graves and A. Mesbah, Proceedings of American Control Conference (ACC) , Boston, p 4889-4894, 2016. https://doi.org/10.1109/ACC.2016.7526127

2015

  1. Gaur, N., Szili, E. J., Oh, J., Hong, S., Michelmore, A., Graves, D. B., … Short, R. D. (2015). Combined effect of protein and oxygen on reactive oxygen and nitrogen species in the plasma treatment of tissue. Applied Physics Letters, 107(10), 103703. http://doi.org/10.1063/1.4930874

2014

  1. “Low temperature plasma biomedicine,” D. B. Graves, Physics of Plasmas, 21(8), article number 080901, 2014. http://dx.doi.org/10.1063/1.4892534.

  2. “Quantification of air plasma chemistry for surface disinfection,” M.J. Pavlovich, D.S. Clark, and D.B. Graves, Plasma Sources Science and Technology, 23 (6), Article number 065036, 2014. http://dx.doi.org/10.1088/0963-0252/23/6/065036

  3. “Fast 2D fluid-analytical simulation of ion energy distributions and electromagnetic effects in multi-frequency capacitive discharges,” E. Kawamura, M.A. Lieberman, and D.B. Graves, Plasma Sources Science and Technology, 23 (6), Article number 064003, 2014. http://dx.doi.org/10.1088/0963-0252/23/6/064003.

  4. “Reactive Species from Cold Atmospheric Plasma,” D.B. Graves, Plasma Processes and Polymers, 11 (12), 1120-1127, 2014. http://dx.doi.org/10.1002/ppap.201400068.

  5. “Air spark-like plasma source for antimicrobial NOx generation,” Journal of Physics D: Applied Physics, 47, 224015, 2014. http://dx.doi.org/10.1088/0022-3727/47/50/505202.

2013

  1. Ozone correlates with antibacterial effects from indirect air dielectric barrier discharge treatment of water (M. J. Pavlovich, HW. Chang, Y. Sakiyama, D. S. Clark, D. B. Graves), J. Phys. D: Appl. Phys. 46 145202.  http://dx.doi.org/10.1088/0022-3727/46/14/145202.

  2. Effect of Discharge Parameters and Surface Characteristics on Ambient-Gas Plasma Disinfection (M. J. Pavlovich, Z. Chen, Y. Sakiyama, D. S. Clark, D. B. Graves), Plasma Processes and Polymers 10 69-76. http://dx.doi.org/10.1002/ppap.201200073.

  3. Plasma Deactivation of Endotoxic Biomolecules: Vacuum Ultraviolet Photon and Radical Beam Effects on Lipid A (Ting-Ying Chung, Ning Ning, Jhih-Wei Chu, David B. Graves, Elliot Bartis, Joonil Seog and Gottlieb S. Oehrlein), Plasma Processes and Polymers (as online pre-print). http://dx.doi.org/10.1002/ppap.201200087.

2012

  1. The emerging role of reactive oxygen and nitrogen species in redox biology and some implications for plasma applications to medicine and biology (David B Graves), J Phys D: Appl. Phys. 45 263001. http://dx.doi.org/10.1088/0022-3727/45/26/263001.

  2. Platinum nanocluster growth on vertically aligned carbon nanofiber arrays: Sputtering experiments and molecular dynamics simulations (Pascal Brault, Amal Caillard, Christine Charles, Rod W. Boswell, David B. Graves), Applied Surface Science 263 352-356. http://dx.doi.org/10.1016/j.apsusc.2012.09.059.

  3. Ion activation energy delivered to wounds by atmospheric pressure dielectric-barrier discharges: sputtering of lipid-like surfaces (Natalia Yu Babaeva, Ning Ning, David B Graves, and Mark J Kushner), J Phys D: Appl. Phys. 45 115203. 
    http://dx.doi.org/10.1088/0022-3727/45/11/115203.

  4. Dynamics of ozone generation and mode transition in air Surface Micro-Discharge plasma at atmospheric pressure (T. Shimizu, Y. Sakiyama, D. B. Graves, J. L. Zimmermann, and G. E. Morfill), New. J. Phys. 14 103028. 
    http://dx.doi.org/10.1088/1367-2630/14/10/103028.

  5. Plasma Chemistry Model of Surface Micro-discharge in Humid Air and Dynamics of Reactive Neutral Species (Y. Sakiyama, D. B. Graves, H.-W. Chang T. Shimizu, G. E. Morfill), J. Phys. D: Appl. Phys. 45 425201. Table 2 is available as an xls file. http://dx.doi.org/10.1088/0022-3727/45/42/425201.

  6. Wound Healing Modeling: Investigating Ambient Gas Plasma Treatment Efficacy (M. Orazov, Y. Sakiyama, David B. Graves), J. Phys. D: Appl. Phys. 45 445201. http://dx.doi.org/10.1088/0022-3727/45/44/445201.

2011

  1. Ion and Vacuum Ultraviolet Photon Beam Effects in 193 nm Photoresist Surface Roughening: The Role of the Adamantyl Pendant Group (Ting-Ying Chung, David B. Graves, Florian Weilnboeck, Robert L. Bruce, Gottlieb S. Oehrlein, Mingqi Li, Eric A. Hudson), Plasma Processes and Polymers, 8: 1068-1079. http://dx.doi.org/10.1002/ppap.201100071.

  2. Hydrogenation and surface density changes in hydrocarbon films during erosion using Ar/H2 plasmas (N. Fox-Lyon, G. S. Oehrlein, N. Ning, D. B. Graves), J. Appl. Phys. 110, 104314 (2011); http://dx.doi.org/10.1063/1.3662953.

  3. Plasma-polymer interactions: A review of progress in understanding polymer resist mask durability during plasma etching for nanoscale fabrication (with G.S. Oehrlein, R.J. Phaneuf), J. Vac. Sci. Technol. B 29, 010801 (2011). http://dx.doi.org/10.1116/1.3532949.

  4. The effect of VUV radiation from Ar/SiO2 plasma on low-k SiCOH film, (with J. Lee), J. Phys. D 44 (32), 325203 (2011).

  5. Long-term antibacterial efficacy of air plasma-activated water (Matthew J. Traylor, Matthew J. Pavlovich, Sharmin Karim, Pritha Hait, Yukinori Sakiyama, Douglas S. Clark, David B. Graves), J. Phys. D: Appl. Phys. 44 (2011) 472001. 
    http://dx.doi.org/10.1088/0022-3727/44/47/472001.

  6. Fast 2D hybrid fluid-analytical simulation of inductive/capacitive discharges (with E. Kawamura, M.A. Lieberman), Plasma Sources Sci. Technol. 20, 035009 (2011). http://dx.doi.org/10.1088/0963-0252/20/3/035009.

  7. Effects of vacuum ultraviolet photons, ion energy and substrate temperature on line width roughness and RMS surface roughness of patterned 193 nm photoresist (with M.J. Titus, Y. Yamaguchi and E.A.Hudson), J. Phys. D 44, 085204 (2011). http://dx.doi.org/10.1088/0022-3727/44/8/085204.

2010

  1. Gas flow dependence of ground state atomic oxygen in plasma needle discharge at atmospheric pressure (with Y. Sakiyama, N. Knake, D. Schroder, J. Winter, V. Schulz-von der Gathen, and D. B. Graves) Appl. Phys. Lett. 97 151501 (2010). http://dx.doi.org/10.1063/1.3496041.

  2. Electron, ion and vacuum ultraviolet photon effects in 193nm photoresist surface roughening (with T.-Y. Chung, D. Nest, D. B. Graves, F. Weilnboeck, R. L. Bruce,G. S. Oehrlein, D. Wang, M. Li and E. A. Hudson), J. Phys. D: Appl. Phys. 43, 272001 (2010). http://dx.doi.org/10.1088/0022-3727/43/27/272001.

  3. Role of polymer structure and ceiling temperature in polymer roughening and degradation during plasma processing: a beam system study of P4MS and PαMS (with D. Nest, T.-Y. Chung, J. J. Vegh, D. B. Graves, R. L. Bruce, T. Lin, R. J. Phaneuf, G. S. Oehrlein, B. K. Long and C. G. Willson), J. Phys. D, Appl. Phys. 43, 085204 (2010). http://dx.doi.org/10.1088/0022-3727/43/8/085204.

  4. Finite element analysis of ring-shaped emission profile in plasma bullet (with Y. Sakiyama, D. B. Graves, J. Jarrige, and M. Laroussi), Appl. Phys. Lett. 96, 041501 (2010). http://dx.doi.org/10.1063/1.3298639.

  5. "SensArray" voltage sensor analysis in an inductively coupled plasma (with Titus, MJ and Hsu, CC, Graves, DB), J. Vac. Sci. Tech. A 28, 139-146 (2010). http://dx.doi.org/10.1116/1.3268615.

  6. Relationship between nanoscale roughness and ion-damaged layer in argon plasma exposed polystyrene films, (with R.L. Bruce et al.), J. Appl. Phys., 107(8), 084310 (2010). http://dx.doi.org/10.1063/1.3373587.

  7. Molecular dynamics simulations of sub-10nm wavelength surface rippling by CF3+ ion beams, (with J.J. Vegh), Plasma Source Sci. Tech., 19(4), 045005 (2010). http://dx.doi.org/10.1088/0963-0252/19/4/045005.

  8. Synergistic damage effects of vacuum ultraviolet photons and O2 in SiCOH ultra-low-k dielectric films, (with J. Lee), J. Phys. D, 43(42), 425201 (2010).  http://dx.doi.org/10.1088/0022-3727/43/42/425201.

2009

  1. Neutral gas flow and ring-shaped emission profile in non-thermal RF-excited plasma needle discharge at atmospheric pressure (with Sakiyama, Y and Graves, DB), PLASMA SOURCES SCIENCE & TECHNOLOGY 18, 025022 (2009). 
    http://dx.doi.org/10.1088/0963-0252/18/2/025022.

  2. Absolute vacuum ultraviolet flux in inductively coupled plasmas and chemical modifications of 193 nm photoresist (with Titus, MJ, Nest, D and Graves, DB), Appl. Phys. Lett. 94, 171501 (2009). http://dx.doi.org/10.1063/1.3125260.

  3. Disinfection of E. coli by nonthermal microplasma electrolysis in normal saline solution (with Sakiyama, Y, Tomai, T, Miyano, M and Graves, DB), Appl. Phys. Lett. 94, 161501 (2009). http://dx.doi.org/10.1063/1.3122148.

  4. Modeling and Simulation of Low-Temperature Plasmas (with Lee, JK, Kong, MG, Graves, DB), PLASMA PROCESSES AND POLYMERS 6, 278 (2009). http://dx.doi.org/10.1002/ppap.200907000.

  5. Molecular Dynamics Simulations of Ar+-Organic Polymer Interactions (with Vegh, JJ and Graves, DB), PLASMA PROCESSES AND POLYMERS 6, 320-334 (2009). http://dx.doi.org/10.1002/ppap.200800223.

  6. Study of ion and vacuum ultraviolet-induced effects on styrene- and ester-based polymers exposed to argon plasma (with Bruce, RL, Engelmann, S, Lin, T, Kwon, T, Phaneuf, RJ, Oehrlein, GS, Long, BK, Willson, CG, Vegh, JJ, Nest, D, Graves, DB, Alizadeh, A), J. Vac. Sci. Tech. B 27, 1142-1155 (2009). http://dx.doi.org/10.1116/1.3136864.

  7. Modeling and Data Needs of Atmospheric Pressure Gas Plasma and Biomaterial Interaction (with Sakiyama, Y, Graves, DB), 6th International Conference on Atomic and Molecular Data and Their Applications 1125, 188-193 (2009). http://dx.doi.org/10.1063/1.3141692.

  8. Oxygen radical and plasma damage of low-k organosilicate glass materials: Diffusion-controlled mechanism for carbon depletion (with Goldman, MA, Graves, DB, Antonelli, GA, Behera, SP, Kelber, JA), J. Appl. Phys. 106, 013311 (2009). http://dx.doi.org/10.1063/1.3168428.

  9. Modelling vacuum ultraviolet photon penetration depth and C = O bond depletion in 193 nm photoresist (with Titus, MJ, Nest, DG and Graves, DB), J. Appl. Phys. D-APPLIED PHYSICS 42, 152001 (2009). http://dx.doi.org/10.1088/0022-3727/42/15/152001.

  10. Dependence of Polymer Surface Roughening Rate on Deposited Energy Density During Plasma Processing (with Engelmann, S, Bruce, RL, Weilnboeck, F, Oehrlein, GS, Nest, D, Graves, DB, Andes, C, Hudson, EA), PLASMA PROCESSES AND POLYMERS 6, 484-489 (2009). http://dx.doi.org/10.1002/ppap.200900004.

  11. Molecular dynamics for low temperature plasma-surface interaction studies (with Graves, DB and Brault, P), J. Appl. Phys. D-APPLIED PHYSICS 42, 194011 (2009). http://dx.doi.org/10.1088/0022-3727/42/19/194011.

  12. Understanding the Roughening and Degradation of 193 nm Photoresist during Plasma Processing: Synergistic Roles of Vacuum Ultraviolet Radiation and Ion Bombardment (with Nest, D, Chung, TY, Graves, DB, Engelmann, S, Bruce, RL, Weilnboeck, F, Oehrlein, GS, Wang, DY, Andes, C, Hudson, EA), PLASMA PROCESSES AND POLYMERS 6, 649-657 (2009). http://dx.doi.org/10.1002/ppap.200900039.

  13. A molecular dynamics study of H radical bombardment of CH3 : Si(100)-comparison of simulation and experiment (with Vegh, JJ and Graves, DB), J. Appl. Phys. D-APPLIED PHYSICS 42, 222001 (2009). http://dx.doi.org/10.1088/0022-3727/42/22/222001.

  14. Molecular dynamics simulations of oxygen-containing polymer sputtering and the Ohnishi parameter (with Choudhary, GK, Vegh, JJ and Graves, DB), J. Appl. Phys. D-APPLIED PHYSICS 42, 242001 (2009). http://dx.doi.org/10.1088/0022-3727/42/24/242001.

  15. Comparing 193 nm photoresist roughening in an inductively coupled plasma system and vacuum beam system (with Titus, MJ, Nest, DG, Chung, TY and Graves, DB), J. Appl. Phys. D-APPLIED PHYSICS 42, 245205 (2009).
    http://dx.doi.org/10.1088/0022-3727/42/24/245205.

2008

  1. Silicon etch in the presence of a fluorocarbon overlayer: The role of fluorocarbon cluster ejection (with Vegh, JJ, Humbird, D and Graves, DB), J. Vac. Sci. Tech. A 26, 52-61 (2008). http://dx.doi.org/10.1116/1.2812444.

  2. Modeling electromagnetic effects in capacitive discharges (with Lee, I, Graves, DB and Lieberman, MA), PLASMA SOURCES SCIENCE & TECHNOLOGY 17, 015018 (2008). http://dx.doi.org/10.1088/0963-0252/17/1/015018.

  3. Molecular dynamics simulations of GaAs sputtering under low-energy argon ion bombardment (with Despiau-Pujo, E, Chabert, P, and Graves, DB), J. Vac. Sci. Tech. A 26, 274-280(2008). http://dx.doi.org/10.1116/1.2836408.

  4. Synergistic effects of vacuum ultraviolet radiation, ion bombardment, and heating in 193 nm photoresist roughening and degradation (with Nest, D, Graves, DB, Engelmann, S, Bruce, RL, Weilnboeck, F, Oehrlein, GS, Andes, C, Hudson, EA), Appl. Phys. Lett. 92, 153113 (2008). http://dx.doi.org/10.1063/1.2912028.

  5. Influence of electrical properties of treated surface on RF-excited plasma needle at atmospheric pressure (with Sakiyama, Y, Graves, DB, and Stoffels, E), J. Phys. D-APPLIED PHYSICS 41, 095204 (2008). http://dx.doi.org/10.1088/0022-3727/41/9/095204.

  6. Molecular dynamics simulations of near-surface modification of polystyrene: Bombardment with Ar+ and Ar+/radical chemistries (with Vegh, JJ, Nest, D, Graves, DB, Bruce, R, Engelmann, S, Kwon, T, Phaneuf, RJ, Oehrlein, GS, Long, BK, Willson, CG), J. Appl. Phys. 104, 034308 (2008). http://dx.doi.org/10.1063/1.2963708.

  7. Cold atmospheric plasma: Charged species and their interactions with cells and tissues (with Stoffels, E, Sakiyama, Y and Graves, DB), IEEE TRANSACTIONS ON PLASMA SCIENCE 36, 1441-1457 (2008). http://dx.doi.org/10.1109/TPS.2008.2001084.

  8. Comparison between fluid simulations and experiments in inductively coupled argon/chlorine plasmas (with Corr, CS, Despiau-Pujo, E, Chabert, P, Graham, WG, Marro, FG and Graves, DB), J. Phys. D-APPLIED PHYSICS 41, 185202 (2008). http://dx.doi.org/10.1088/0022-3727/41/18/185202.

  9. Wafer heating mechanisms in a molecular gas, inductively coupled plasma: in situ, real time wafer surface measurements and three-dimensional thermal modeling (with Titus, MJ and Graves, DB), J. Vac. Sci. Tech. A 26, 1154-1160 (2008). http://dx.doi.org/10.1116/1.2953713.

  10. Molecular Dynamics Simulations Of Nanometer-Scale Feature Etch (with Vegh, JJ, Graves, DB), 1st International Conference on Laser and Plasma Applications in Materials Science, LASER AND PLASMA APPLICATIONS IN MATERIALS SCIENCE 1047, 74-78 (2008). http://dx.doi.org/10.1063/1.2999971.

2007

  1. Nonthermal atmospheric rf plasma in one-dimensional spherical coordinates: Asymmetric sheath structure and the discharge mechanism, (With Y. Sakiyama) J. Appl. Phys. 101 (7), 2007. http://dx.doi.org/10.1063/1.2715745.

  2. Modeling of atmospheric-pressure plasma columns sustained by surface waves, (with Y. Kabouzi, E. Castanos-Martinez, et al.) Phys. Rev. E. 75 (1), 2007. http://dx.doi.org/10.1088/0022-3727/16/9/013.

  3. Penetration of fluorine into the silicon lattice during exposure to F atoms, F-2, and XeF2: Implications for spontaneous etching reactions, (with H.F. Winters and D. Humbird), J. Vac. Sci. Tech. A. 25 (1): 96-103, 2007. http://dx.doi.org/10.1116/1.2400680.

  4. Y. Sakiyama and D. B. Graves, "Non-thermal atmospheric RF plasma in one-dimensional spherical coordinates: a parametric study," IEEE Trans. Plasma Sci. 35 (2007) 1279. http://dx.doi.org/10.1109/TPS.2007.906129.

2006

  1. Electron impact dissociation cross sections for C2F6 (with D.W. Flaherty, M.A. Kasper, J.E. Baio, et al.), J. Phys. D. 39 (20) 4393-4399, 2006. http://dx.doi.org/10.1088/0022-3727/39/20/015.

  2. Comparison of model and experiment for Ar, Ar/O-2 and Ar/O-2/Cl-2 inductively coupled plasmas (with C.C. Hsu, M.A. Nierode, J.W. Coburn, et al) J. Phys. D. 39 (15): 3272-3284, 2006. http://dx.doi.org/10.1088/0022-3727/39/15/009.

  3. Finite element analysis of an atmospheric pressure RF-excited plasma needle, (with Y. Sakiyama) J. Phys. D: Appl. Phys. 39 (16) 3451-3456, 2006. http://dx.doi.org/10.1088/0022-3727/39/16/S01.

  4. Corona-glow transition in the atmospheric pressure RF-excited plasma needle, (with Y. Sakiyama) J. Phys. D: Appl. Phys. 39 (16) 3644-3652, 2006. http://dx.doi.org/10.1088/0022-3727/39/16/018.

2005

  1. Etching of ruthenium coatings in O-2- and Cl-2-containing plasmas, (with C.C. Hsu and J.W. Coburn), J. Vac. Sci. Tech. A 24 (1), 2005. http://dx.doi.org/10.1116/1.2121751.

  2. Nitrogen dissociation in a low pressure cylindrical ICP discharge studied by actinometry and mass spectrometry, (with T. Czerwiec and F. Greer) J. Phys D:- Appl. Phys. 38 (24): 4278-4289, 2005. http://dx.doi.org/10.1088/0022-3727/38/24/003.

  3. Silicon etch by fluorocarbon and argon plasmas in the presence of fluorocarbon films, (with J.J. Végh and D. Humbird), J. Vac. Sci. Tech., 23(6), 1598-1604, 2005. http://dx.doi.org/10.1116/1.2049304.

  4. Molecular dynamics simulations of plasma-surface interactions: importance of visualization tools, (with D. Humbird), IEEE Transactions on Plasma Science, 33 (2), 226-7, 2005. http://dx.doi.org/10.1109/TPS.2005.844953.

  5. CF and CF₂ radical kinetics and transport in a pulsed CF₄ ICP, (with JP Booth, H Abada, and P Chabert ), Plasma Sources Science & Technology, 14(2), 273-82, 2005. http://dx.doi.org/10.1088/0963-0252/14/2/008.

  6. Microhollow cathode discharge reactor chemistry, (with D. Hsu), Plasma Chemistry & Plasma Processing, 25 (1), 1-17, 2005. http://dx.doi.org/10.1007/s11090-004-8831-8.

  7. Mode transitions in low pressure rare gas cylindrical ICP discharge studied by optical emission spectroscopy, (with T Czerwiec), J. Phys. D, Appl. Phys., 37(20), 2827-40, 2005. http://dx.doi.org/10.1088/0022-3727/37/20/009.

  8. Atomistic simulations of Ar+-ion-assisted etching of silicon by fluorine and chlorine, (with D. Humbird), JVSTA, 23(1):31-8, 2005. http://dx.doi.org/10.1116/1.1814106.

2004

  1. Vacuum beam studies of fluorocarbon radicals and argon ions on Si and SiO2 surfaces, (with Y. Kimura and JW Coburn), JVSTA, 22(6):2508-16, 2004. http://dx.doi.org/10.1116/1.1810166.

  2. Molecular dynamics simulations of Si-F surface chemistry with improved interatomic potentials, (with D. Humbird), Plasma Source Science and Technology, 13(3), 548-52, 2004. http://dx.doi.org/10.1088/0963-0252/13/3/022.

  3. Mechanism of silicon etching in the presence of CF2, F, and Ar+, (with D. Humbird), J. Appl. Phys., 96(5):2466-71, 2004. http://dx.doi.org/10.1063/1.1769602.

  4. Fluorocarbon plasma etching of silicon: Factors controlling etch rate, (with D. Humbird), J. Appl. Phys., 96(1):65-70, 2004. http://dx.doi.org/10.1063/1.1736321.

  5. Atomistic Simulations of Spontaneous Etching of Silicon by Fluorine and Chlorine, (with D. Humbird), J. Applied Physics, 96(1):791-798, 2004. http://dx.doi.org/10.1063/1.1753657.

  6. Molecular dynamics simulations of Ar+-induced transport of fluorine through fluorocarbon films, (with G.S. Oehrlein, X.F. Hsu, and D. Humbird), Applied Physics Letters, 84(7):1073-1075, 2004. http://dx.doi.org/10.1063/1.1644338.

  7. Improved interatomic potentials for silicon-fluorine and silicon-chlorine, (with D. Humbird), J. Chemical Physics, 120 (5), 2405-2412, 2004. http://dx.doi.org/10.1063/1.1636722.

2003

  1. Microhollow cathode discharge stability with flow and reaction, (with D. Hsu), J. Physics D-Applied Physics, 36(23):2898-2907, 2003. http://dx.doi.org/10.1088/0022-3727/36/23/006.

  2. Fluorine atom subsurface diffusion and reaction in photoresist, (with F. Greer, D. Fraser, and J. Coburn), J. Appl. Physics, 94 (12) , 7453-7461, 2003. http://dx.doi.org/10.1063/1.1625782.

  3. Influence of modeling and simulation on the maturation of plasma technology: Feature evolution and reactor design (with M.J. Kushner). JVST A21(5 Suppl S):S152-S156, 2003. http://dx.doi.org/10.1116/1.1600447.

  4. Fundamental beam studies of radical enhanced atomic layer deposition of TiN, (with F. Greer, J.W. Coburn, and D. Fraser), JVSTA, 21(1):96-105, 2003. http://dx.doi.org/10.1116/1.1524145.

  5. Silicon epitaxial growth on the Si(001)2x1 surface from silane using dynamic Monte Carlo simulations, (with K. Satake), J. Chem. Phy. 118(14):6503-6511, 2003. http://dx.doi.org/10.1063/1.1559151.

  6. Molecular dynamics simulations of ion bombardment on hydrogen terminated Si(001) 2x1 surface, (with K. Satake), JVSTA, 21(2):484-490, 2003. 

  7. Inductively Coupled Plasmas in Oxygen: Modeling and Experiment, (with M. W. Kiehlbauch), JVSTA, 21(3): 660-670, 2003. http://dx.doi.org/10.1116/1.1564024.

  8. C₄F₈ Dissociation in an Inductively Coupled Plasma, (with M. T. Radtke, and J. W. Coburn), JVSTA, 21(4):1038-1047, 2003. http://dx.doi.org/10.1116/1.1582456.

  9. Fundamental Beam Studies of Deuterium and Fluorine Radical Reaction Kinetics on Surfaces, (with F. Greer), JVST , 21(4):1391-1402, 2003. http://dx.doi.org/10.1116/1.1585065.

  10. The Effect of Neutral Transport on the Etch Product Lifecycle during Plasma Etching of Silicon in Chlorine Gas, (with M.W. Kiehlbaugh), JVSTA, 21(1):116-126, 2003. http://dx.doi.org/10.1116/1.1527952.

2002

  1. Neutral gas temperatures measured within a high-density, inductively coupled plasma abatement device (with E. Tonnis), J. Vac.Sci.Tech A, 20(5):1787-1795, 2002. http://dx.doi.org/10.1116/1.1503901.

  2. Argon and Oxygen Ion Chemistry Effects in Photoresist Etching, (with F.Greer, L.Van, D. Fraser, and J. W. Coburn), JVST B, 20(5):1901-1906, 2002. http://dx.doi.org/10.1116/1.1501578.

  3. Controlling Surfaces in Plasma Processing: Role of Ions via Molecular Dynamics Simulations of Surface Chemistry, (with D. Humbird), Plasma Sources Science and Technology, 11(3A Special Issue SI):A191-A195, 2002. 
    http://dx.doi.org/10.1088/0963-0252/11/3A/328.

  4. Surface chemistry associated with plasma etching processes, (with D. Humbird), Applied Surface Science, 192(1-4), 72-87, 2002. http://dx.doi.org/10.1016/S0169-4332(02)00021-1.

  5. Ion-induced damage and annealing of silicon. Molecular dynamics simulations, (with D. Humbird), Pure and Applied Chemistry, 74(3), 419-422, 2002. http://dx.doi.org/10.1351/pac200274030419.

  6. Deuterium and fluorine radical reaction kinetics on photoresist, (with F. Greer and J.W. Coburn), JVST B, 20(1),145-153, 2002. http://dx.doi.org/10.1116/1.1430242.

  7. Modeling argon inductively coupled plasmas: The electron energy distribution function and metastable kinetics, (with M.W. Kiehlbauch), J. Appl. Phys, 91(6), 3539-3546, 2002. http://dx.doi.org/10.1063/1.1452772.

2001

  1. Molecular Dynamics Simulations of Ion-Surface Interactions with Applications to Plasma Processing, (with C.F. Abrams) Advances in Chemical Engineering, Vol. 28, 149-202, 2001. http://books.google.com/books?id=aZG_6vbHzQMC&pg=PA149.

  2. Temperature Resolved Modeling of Plasma Abatement of Perfluorinated Compounds, (with M. W. Kiehlbaugh), J. Appl. Phys., 89(4), 2047-2057, 2001. http://dx.doi.org/10.1063/1.1337088.

  3. Atomistic Simulation of Fluorocarbon Deposition on Si by Continuous Bombardment with Energetic CF+ and CF2+, (with C.F. Abrams), JVST A, 19(1), 175-181, 2001. http://dx.doi.org/10.1116/1.1322652.

  4. Measurements of Neutral and Ion Composition, Neutral Temperature, and EEDF in a CF4 Inductively Coupled Plasma, (with H. Singh and J.W. Coburn), JVSTA, 19(3), 719-729, 2001. http://dx.doi.org/10.1116/1.1354603.

2000

  1. Recombination coefficients of O and N radicals on stainless steel, (with H. Singh and J.W. Coburn), J. Appl. Phys. ,88, 3748, 2000. http://dx.doi.org/10.1063/1.1289046.

  2. Vacuum beam studies of photoresist etching kinetics, (with F. Greer, J.W. Coburn, and D.B. Graves), JVST A,18, 2288, 2000. http://dx.doi.org/10.1116/1.1287721.

  3. Surface Loss Coefficients of CFx and F Radicals on Stainless Steel, (with H. Singh and J.W. Coburn), JVST A, 18, 2680, 2000. http://dx.doi.org/10.1116/1.1308585.

  4. Atomistic simulation of silicon bombardment by energetic CF3+: Product distributions and energies, (with C.F. Abrams), Thin Solid Films, 374, 150, 2000. http://dx.doi.org/10.1016/S0040-6090(00)01145-7.

  5. Measurements of the electron energy distribution function in molecular gases in a shielded inductively coupled plasma, (with H. Singh), J. Appl. Phys., 88 (7), 3889, 2000. http://dx.doi.org/10.1063/1.1290450.

  6. Molecular dynamics simulations of Si etching with energetic F+: Sensitivity of the results to the interatomic potential, (with C.F. Abrams), J. Appl. Phys., 88, 3734, 2000. http://dx.doi.org/10.1063/1.1288701.

  7. On the active surface layer in CF3+ etching of Si: Atomistic simulation and a simple mass balance model, (with C.F. Abrams), JVST A 18(2), 411, 2000. http://dx.doi.org/10.1116/1.582202.

  8. New C-F interatomic potential for molecular dynamics simulation of fluorocarbon film formation, (with J. Tanaka, and C.F. Abrams),?JVST A 18(3), 938 , 2000. http://dx.doi.org/10.1116/1.582279.

  9. Appearance potential mass spectrometry: Discrimination of dissociative ionization products, (with H. Singh and J.W. Coburn), JVSTA, 18(2), 299, 2000. http://dx.doi.org/10.1116/1.582183.

  10. Measurements of the electron energy distribution function in molecular gases in an inductively coupled plasma, (with H. Singh), J. Appl. Phys., 87(9), 4098, 2000. http://dx.doi.org/10.1063/1.373036.

1999

  1. Molecular dynamics simulations of Si etching by energetic CF3+, (with C.F. Abrams) J. Appl. Phys., 86, 5938, 1999. http://dx.doi.org/+10.1063/1.371637.

  2. Hardmask Charging during Cl2 Plasma Etching of Silicon, (with M.A. Vyvoda and M. Li), J. Vac. Sci. Tech. A, 17(6), 3293, 1999. http://dx.doi.org/+10.1116/1.582056.

  3. Inductively-coupled, point-of-use plasma abatement of PFCs and HFCs from etch processes utilizing O2 and H2O as additive gases, (with E.J. Tonnis, V.H. Vartanian, L. Beu, T. Lii, and R. Jewett), JVST A, 18, 393, 2000. http://dx.doi.org/+10.1116/1.582199.

  4. The Role of Sidewall Scattering in Feature Profile Evolution During Cl2 and HBr Plasma Etching of Silicon, (with M.A. Vyvoda), JVST B, 18, 820, 1999. http://dx.doi.org/+10.1116/1.591282.

  5. Trapping dynamics of ethane on Si(100)-(2x1): molecular beam experiments and molecular dynamics simulations, (with C.T. Reeves, B.A. Ferguson, C.B. Mullins, G.O. Sitz, and B.A. Helmer), J. Chem. Phys., 111, 7567-7575, 1999. http://dx.doi.org/10.1063/1.480083.

  6. Mass Spectrometric Detection of Reactive Neutral Species: Beam to Background Ratio, (with H. Singh and J.W. Coburn, JVST A, 17(5), 2447-2455, 1999. http://dx.doi.org/+10.1116/1.581981.

  7. Cu Sputtering and deposition of off-normal, near-threshold Cu+ bombardment: Molecular dynamics simulations, (with C.F. Abrams), J. Appl. Phys., 86(4), 2263, 1999. http://dx.doi.org/+10.1063/1.371040.

  8. 3D Spatiokinetic Distributions of Sputtered and Scattered Products of Ar+, and Cu+ Impacts onto the Cu Surface: Molecular Dynamics Simulations, (with C.F. Abrams), IEEE Trans. Plasma Sci., 27(5), 1426, 1999. http://dx.doi.org/10.1109/27.799821.

  9. Feature Evolution Simulations of Copper Seed Layer Deposition Using Atomic-level Particle Scattering Information, (with M.A. Vyvoda and C.F. Abrams), IEEE Trans. Plasma Sci., 27(5), 1433, 1999. http://dx.doi.org/10.1109/27.799822.

  10. Numerical Modeling (with M. Li and M. Vyvoda), Chapter 8 in Ionized Physical Vapor Deposition, Ed. J. Hopwood, Academic Press, NY, 1999. http://books.google.com/books?id=PF10xSUqcysC&pg=PA209.

  11. A Model of Point-of-Use Plasma Abatement of Perfluorinated Compounds with An Inductively Coupled Plasma, (with A. Fiala, M. Kiehlbauch, and S, Mahnovski), , J. Appl. Phys., 86(1), 152-162, 1999. http://dx.doi.org/+10.1063/1.370711.

  12. Molecular dynamics simulations of Cl2+ impacts onto a chlorinated silicon surface: energies and angles of the reflected Cl2 and Cl fragments, (with B.A. Helmer), J. Vac. Sci. Tech. A, 17(5), 2759-2770, 1999. http://dx.doi.org/10.1116/1.581942.

  13. Heteronuclear and homonuclear surface abstraction reactions of Cl, Br and F, with G.P. Kota and J.W. Coburn), J.Appl. Phys., 85(1), 74, 1999. http://dx.doi.org/10.1063/1.369423.

  14. Heterogeneous recombination of atomic bromine and fluorine, (with G.P. Kota and J.W. Coburn), J.Vac. Sci. Tech. A, 17(1), 282-290, 1999. http://dx.doi.org/+10.1116/1.581582.

1998

  1. Effects of plasma conditions on the shapes of features etched in Cl2 and HBr Plasmas. I. Bulk crystalline silicon etching, (with M.A. Vyvoda, H. Lee, M. Malyshev, F. Klemens, M. Cerullo, V. Donnelly, A. Kornblit, and J. Lee), J. Vac. Sci. Tech. A, 16(6), 3247, 1998.
    http://dx.doi.org/+10.1116/1.581530.

  2. Energetic ion bombardment of SiO2 surfaces: Molecular dynamics simulations, (with C.F. Abrams), J. Vac. Sci. Tech. A, 16(5), 3006, 1998. http://dx.doi.org/+10.1116/1.581452.

  3. Molecular dynamics simulations of Ar+ and Cl+ impacts onto silicon surfaces: distributions of reflected energies and angles, (with B.A. Helmer), J. Vac. Sci. Tech. A, 16(6), 3502, 1998. http://dx.doi.org/10.1116/1.580993.

  4. Fluid, Kinetic and Hybrid Simulation Strategies for Modeling Chemically Complex Inductively Coupled Plasmas, (with M. Li, and H. Date), Electron Kinetics and Applications of Glow Discharges, Ed. U. Kortshagen and L. Tsendin, Plenum Press, New York, p. 349-366, 1998. http://dx.doi.org/10.1007/0-306-47076-4_21.

  5. Role of Oxygen in Ion-Enhanced Etching of Poly-Si and WSix with Chlorine, (with G.P. Kota and J.W. Coburn), J.Vac. Sci. Tech. A, 16(4), 2215 1998. http://dx.doi.org/+10.1116/1.581330.

  6. The recombination of chlorine atoms at surfaces, (with G.P. Kota and J.W. Coburn), J.Vac. Sci. Tech. A, 16(1), 270, 1998. http://dx.doi.org/+10.1116/1.580982.

1997

  1. Molecular dynamics simulations of fluorosilyl species impacting fluorinated silicon surfaces with energies from 0.1 eV to 100 eV, (with B.A. Helmer), J. Vac. Sci. Tech. A, 15(4), 2252, 1997. http://dx.doi.org/10.1116/1.580542.

1996

  1. Two-dimensional fluid model of an inductively coupled plasma with comparison to experimental spatial profiles, (with J.D. Bukowski and P. Vitello), J. Applied Phys., 80, 2614, 1996. http://dx.doi.org/+10.1063/1.363169.

  2. In Situ Characterization of the Transient Behavior of Particles in Low Pressure Plasmas, (with U.I. Schmidt), J. Vac. Sci. Tech. A, 14, 595, 1996. http://dx.doi.org/10.1116/1.580151.

  3. Molecular Dynamics Simulations of Direct Reactive Ion Etching: Surface Roughening of Silicon by Chlorine, (with M.E. Barone and T.O. Robinson), IEEE Transactions on Plasma Science, 24, 77, 1996. http://dx.doi.org/10.1109/27.491699.

  4. Molecular Dynamics Simulations of Plasma-Surface Chemistry, (with M.E. Barone), Plasma Sources Science and Technology, 5, 1, 1996. http://dx.doi.org/10.1088/0963-0252/5/2/011.

  5. Role of Etch Products in Polysilicon Etching in a High Density Chlorine Discharge, (with C. Lee, and M.A. Lieberman), Plasma Chemistry Plasma Processing, 16, 99, 1996. http://dx.doi.org/10.1007/BF01465219.

1995

  1. Molecular Dynamics Simulations of Direct Reactive Ion Etching of Silicon by Fluorine and Chlorine, (with M.E. Barone), J. Appl. Phys., 78, 6604, 1995. http://dx.doi.org/10.1063/1.360482.

  2. Matching an RF Sheath Model to a Bulk Plasma Model, (with T.E. Nitschke), IEEE Trans. Plasma Sci., 23, 717, 1995. http://dx.doi.org/10.1109/27.467994.

  3. Derivation and experimental verification of a particulate transport model for a glow discharge, (with J.E. Daugherty), J. Appl. Physics, 78, 2279, 1995. http://dx.doi.org/10.1063/1.360145.

  4. Chemical and Physical Sputtering of Fluorinated Silicon, (with M.E. Barone), J. Appl. Phys., 77, (3), 1263, Feb, 1995.
    http://dx.doi.org/10.1063/1.358928.

1994

  1. Global Model of Plasma Chemistry in a High Density Oxygen Discharge (with C. Lee, D.W. Hess, and M.A. Lieberman), J. Electrochemical Society, 141, 1546, 1994. 

  2. A Comparison of Particle in Cell and Fluid Model Simulations of Low-Pressure Radio Frequency Discharges, (with T.E. Nitschke), J. Appl. Phys., 76, (10), 5646, Nov, 1994. 

  3. Plasma Uniformity in High-density Inductively Coupled Plasma Tools, (with R.A. Stewart, P. Vitello, E.F. Jaeger, and L.A. Berry), Plasma Sources Sci. Technol. 4, 36, Aug, 1994. 

  4. Comparison Between a Two-Dimensional Simulation and a Global Conservation Model for a Compact ECR Plasma Source, (with H-M. Wu, and R.K. Porteous), Plasma Sources Sci. Technol. 4, 22, Oct, 1994. 

  5. Charging, Transport and Heating of Particles in Radiofrequency and Electron Cyclotron Resonance Plasmas, (with J.E. Daugherty, M.D. Kilgore, and R.K. Porteous), Plasma Sources Sci. Technol. 3, 433, Jan, 1994. 

  6. Plasma Processing, (Invited Review), IEEE Trans. Plasma Sci., 22, 31, 1994. 

  7. The Gaseous Electronics Conference Radio-Frequency Reference Cell: A defined parallel plate radio-frequency system for experimental and theoretical studies of plasma-processing discharges, (with 32 others), Rev. Sci. Instrum., 65, 140, 1994. 

  8. A Two-Dimensional Fluid Model of High Density Inductively Coupled Plasma Sources, (with R.A. Stewart and P. Vitello) J. Vac. Sci. and Tech. B, 12, 478, 1994. 

  9. Neutral Transport in High Plasma-Density Reactors, (with M.D. Kilgore, and H.M. Wu), J. Vac. Sci. and Tech. B, 12, 494, 1994. 

  10. Transport and Heating of Small Particles in High Density Plasma Sources, (with M.D. Kilgore, J.E. Daugherty, and R.K. Porteous), J. Vac. Sci. and Tech. B, 12, 486, 1994. 

  11. A Two-Dimensional Axisymmetric Model of a Magnetized Glow Discharge Plasma (with R.K. Porteous and H.-M. Wu), Plasma Sources Science and Technology, 3, 25, 1994. 

1993

  1. Particulate Temperature in rf Glow Discharges, (with J.E. Daugherty), J. Vac. Sci. Tech. A, 11. 1126, 1993. 

  2. Modeling and Simulation of High Density Plasmas, (with H.-M. Wu and R.K. Porteous), Japanese Journal of Applied Physics, 32, 2999, 1993. 

  3. Ion Drag on an Isolated Particulate in a Low Pressure Discharge (with M.D. Kilgore, J.E. Daugherty and R.K. Porteous), J. Appl. Phys., 73, 7195, 1993. 

  4. Electrostatic Forces on Small Particles in Low Pressure Discharges (with J.E. Daugherty and R.K. Porteous), J. Appl. Phys., 73. 1617, 1993. 

  5. Spin Coating over Topography (with L.M. Peurrung), IEEE Trans. Semicond. Manufac., 6, 72, 1993. 

1992

  1. A Model of Particulates in Glow Discharge Plasmas (with M.D. Kilgore, J.E. Daugherty and R.K. Porteous), Proc. Electrochemical Society, 92-18, 221, 1992. http://dx.doi.org/10.1063/1.347632.

  2. Sheath Structure Around Particles in Low Pressure Discharges (with J.E. Daugherty, M.D. Kilgore, and R.K. Porteous), J. Appl. Phys., 72, 3934, 1992. http://dx.doi.org/10.1063/1.352245.

  3. Self-Consistent DC Glow Discharge Simulations Applied to Diamond Film Deposition Reactors (with M. Surendra and L.S. Plano), J. Appl. Phys., 71, 5189, 1992. http://dx.doi.org/10.1063/1.350575.

1991

  1. Capacitively Coupled Glow Discharges at Frequencies above 13.56 MHz (with M. Surendra), Applied Physics Letters, 59, 2091, 1991. 

  2. Film Thickness Profiles over Topography in Spin Coating (with L.M. Manske), J. Electrochem Soc., 138, 2115, 1991. 

  3. Particle Thermophoresis in Low Pressure Glow Discharges (with G.M. Jellum and J.E. Daugherty), J. Appl. Phys., 69, 6923, 1991. 

  4. Modeling and Simulation of Magnetically Confined, Low Pressure Plasmas in Two Dimensions (with R.K. Porteous), IEEE Trans. Plasma Sci., 19, 204, 1991). 

  5. Particle Simulations of Radiofrequency Glow Discharges (with M. Surendra), IEEE Trans. Plasma Sci., 19, 144, 1991. 

  6. Electron Acoustic Waves in Capacitatively Coupled, Low-pressure RF Glow Discharges (with M. Surendra), Phys. Rev. Lett., 66, 1469, 1991. 

1990

  1. Particle-plasma Interactions in Low Pressure Discharges (with G.M. Jellum), Applied Physics Letters, 57, 2077, 1990. 

  2. Computer Applications in Plasma materials Processing (with R.A. Gottscho), Computers in Physics, 584, November/December, 1990. 

  3. Dynamic Measurements of Film Thickness over Local Topography in Spin Coating (with L.M. Manske and W.B. Oldham), Applied Physics Letters, 56, 2348, 1990. 

  4. Particulates in Aluminum Sputtering Discharges (with G.M. Jellum), J. Appl. Phys., 67, 6490, 1990. 

  5. Electron Heating in Low Pressure glow Discharges (with M. Surendra and I.J. Morey), Applied Physics Letters, 56, 1022, 1990. 

  6. Non-equilibrium Effects in DC and RF Glow Discharges (with M. Surendra), Chapter in Non-Equilibrium Effects in Ion and Electron Transport, edited by E.E. Kunhardt, R. Van Brunt, J. Gallagher and D. Hudson, 157, Plenum, New York, 1990. 

  7. Self-consistent model of a Direct-current Glow Discharge: Treatment of Fast Electrons (with M. Surendra and G.M. Jellum), Phys. Rev. A., 41, 1112, 1990. 

1982 - 1989

  1. Photoelectron-initiated Avalanches in Low Pressure Glow Discharges (with A. Mitchell, G.R. Scheller and R.A. Gottscho), Phys. Rev. A., 40, 5199, 1989. 

  2. Plasma-enhanced Etching and Deposition (with D.W. Hess), Chapter 8 in Microelectronics Processing, Advances in Chemistry 221, American Chemical Society, Washington, DC, 1989. 

  3. Plasma Processing in Electronic Materials Processing, AIChE J. (Journal Review), 35, 1-29, 1989. 

  4. Local Field and Ballistic Electron Models for Low Pressure RF and DC Glow Discharges (with R.A. Gottscho, A. Mitchell, G.R. Scheller, N.L. Schryer and J.-P Boeuf), Proc. Seventh Symposium on Plasma Processing, 88-22), 1, Eds. G.S. Mathad, G.C. Schwartz and D.W. Hess, Electrochemical Society, Pennington, NJ, 1988. 

  5. Nonlinear Excitation and Dissociation Kinetics in Discharges through Mixtures of Rare and Attaching Gases (with R.A. Gottscho, G.R. Scheller and T. Intrator), J. Appl. Phys., 64(9) 4384-4397, 1988. 

  6. Quenching Rates of Ar Metastables in Radio-frequency Glow Discharges (with G.R. Scheller, R.A. Gottscho and T. Intrator), J. Appl. Phys., 64(2), 598-606, 1988. 

  7. Space-time Resolved Kinetics of Mixed Rare-gas-attaching Gas Plasmas (with R.A. Gottscho, G.R. Scheller and T. Intrator), J. Vac. Sci. Tech. A, 6(3), 1393-1396, 1988. 

  8. Fluid Model Simulations of a 13.56 MHz RF Discharge: Time and Space Dependence of Rates of Electron Impact Excitation, J. Appl. Phys., 62(1), 88-94, 1987. 

  9. Modeling of Plasma Processing, Proc. 6th Symposium on Plasma Processing, vol. 87-6, Electrochem. Soc., G.S. Mathad, G.C. Schwartz and R.A. Gottscho, Eds., 267-288, 1987. 

  10. Theoretical and Computational Problems in Modeling glow Discharges (with K.F. Jensen), Materials Research Soc. Symposia Proc., vol. 68, J.W. Coburn, R.A. Gottscho and D.W. Hess, Eds., 29-230, 1986. 

  11. A Continuum Model of DC and RF Discharges (with K.F. Jensen), IEEE Trans. Plasma. Sci., PS-14 (2), 78-91, 1986. 

  12. Modeling of Reactors for Plasma Processing I. Silicon Etching by CF4 in a Radial Flow Reactor (with M. Dalvie and K.F. Jensen), Chem. Eng. Sci., 41(4), 653-660. 

  13. CVD in Stagnation Point Flow (with C. Houtman and K.F. Jensen), J. Electrochem Soc. 133(5), 1986, 961-970. 

  14. Modeling and Analysis of Low Pressure CVD Reactors (with K.F. Jensen), J. Electrochem. Soc. 130(9), 1950-1957, 1983. 

  15. Flammability Characteristics and Structure of Pulverized Coal, Laminar Opposed Jet Diffusion Flame (with J.O.L. Wendt), 19th Symposium (international) on Combustion, The Combustion Institute, 1189-1196, 1982.